McKleroy Associates

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McKleroy Associates is well known for developing and implementing electronic packaging solutions for high reliabilty products.

McKleroy Associates has worked with a broad spectrum of companies including startups in the telecom, optical and RF arena as well as mature companies in the semiconductor and high-reliability military domain.
 
Chris McKleroy works with engineering teams to guide the development of prototype modules and manage the transition to manufacturable products. He has an expertise in material science to optimize the fabrication methods for high frequency electronic modules. In addition, Chris has developed and delivered robust processes for fine line (150 um) glass frit printing for wafer scale bonding, hybrid RF packaging for 40Ghz broadband applications and sub-micron optical alignment systems for high reliability military products.
 
Chris has also identified cost effective capital equipment investment opportunties. For example, he located and setup refurbished equipment for assembly operations including YAG laser welding systems for hermetic sealing, high resolution optical profilometers, and argon plasma cleaners.
 
Key areas of expertise also include extensive knowledge of the JEDEC, Telecordia and Mil-Specs.
Extensive Experience in Silicon Valley:
 
Previous clients/employers include: Endwave Corporation, Big Bear Networks, Red Clover Networks, Teraburst Networks, Litton Corporation – Applied Technology Division, and National Semiconductor.
 
Electronic Packaging Design: Chris McKleroy has more than 20 years of experience working with RF, Optics and MEMS organizations and develops electronic packaging solutions using  ACAD and Solidworks.
 
Education: Chris graduated from UC Davis with a Bachelor of Science in Mechanical Engineering.  He received a Masters in Business Administration from Golden Gate University.
 
Patents: Chris holds a patent in low-cost microwave packaging and co-authored a patent for a miniature optical switch engine. He has presented numerous papers in microwave packaging technology
Clients include: 
 
Microwave Technology: Developed QFN Packaging for high power WiMAX and home network broadband applications. Transferred to on-shore Contract Manufacturer (CM) for initial production and to low-cost offshore CMs for volume production.
 
Centellax: Optimimized production processes for telecom modules. Recommended and implemented high frequency packaging technology for next generation products. Setup YAG laser welding for hermetic sealing for components.

Silicon Microstructures: Developed and optimized wafer scale printing process using glass frit technology. Prepared all production process documents (Procedures, PFMEAs, Control Plan) and trained personnel for production transfer.

Rogers Corporation: Initiated high accuracy screen printing process and methods to meet targets for a “touch screen” cellphone application.
 
Finisar Corporation: Transferred all process and component knowledge for 40G transponder module assembly to key manufacturing personnel.